Reliability analysis of bonded joints with variations in adhesive thickness

Reliability analysis of bonded joints with variations in adhesive thickness

Effect of Bond Thickness on Fracture Behaviour in Adhesive Joints

(2001) Effect of bond thickness on fracture behaviour in adhesive joints. To study the effects of bond thickness on the fracture behaviour of adhesive joints, experimental investigation and finite element analysis have been carried out for compact tension (CT) and double-cantilever-beam (DCB) specimens with different bond thickness. Fractography and fracture toughness exhibited apparent variati...

Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications

New interconnection materials are always necessary as a result of evolving packaging technologies and increasing performance and environmental demands on electronic systems. In particular, anisotropic conductive adhesives (ACAs) have gained popularity as a potential replacement for solder interconnects. Despite numerous benefits, ACA-type packages pose several reliability problems. During the l...

Continuum damage modelling of environmental degradation in joints bonded with EA9321 epoxy adhesive

A mesh independent continuum damage model has been proposed to predict the residual strength of adhesively bonded joints by introducing a displacement-based damage parameter into the constitutive equation of damaged materials. Joints bonded with a ductile adhesive EA9321 were studied for a range of environmental degradation. The moisture dependent damage parameter for EA9321 was calibrated usin...

The Fuzzy Finite Element Stress Analysis of Adhesive-Bonded Single Lap Joints

An adhesive-bonded single lap joint is analyzed using a new fuzzy finite element model. In the model, Young’s moduli and Poisson’s ratios of the joint materials are taken as fuzzy numbers in order to take the uncertainty of the material properties into account. The fuzzy numbers are modeled using linear triangular membership functions. At a selected material point in the adhesive layer, the pos...